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Sensors and Microsystems by Malcovati, Piero. Publication: . XVII, 444p. Availability: Copies available: AUM Main Library (1),
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Deterministic Solvers for the Boltzmann Transport Equation by Hong, Sung-Min. Publication: . XVIII, 227 p. Availability: Copies available: AUM Main Library (1),
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High Permittivity Gate Dielectric Materials by Kar, Samares. Publication: . XXXII, 489 p. 325 illus., 168 illus. in color. Availability: Copies available: AUM Main Library (1),
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Broadband Reflectometry for Enhanced Diagnostics and Monitoring Applications by Cataldo, Andrea. Publication: . XVIII, 150 p. Availability: Copies available: AUM Main Library (1),
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Piezoresistor Design and Applications by Doll, Joseph C. Publication: . XI, 245 p. 101 illus., 86 illus. in color. Availability: Copies available: AUM Main Library (1),
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Fundamentals of Nanoscaled Field Effect Transistors by Chaudhry, Amit. Publication: . XIV, 201 p. 121 illus., 102 illus. in color. Availability: Copies available: AUM Main Library (1),
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Sensors by Kalantar-zadeh, Kourosh. Publication: . XII, 196 p. 141 illus., 47 illus. in color. Availability: Copies available: AUM Main Library (1),
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Solid State Lighting Reliability by van Driel, W.D. Publication: . X, 617 p. 420 illus., 23 illus. in color. Availability: Copies available: AUM Main Library (1),
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Lead Free Solder by Pang, John Hock Lye. Publication: . X, 175p. 162 illus. Availability: Copies available: AUM Main Library (1),
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Microelectronic Test Structures for CMOS Technology by Bhushan, Manjul. Publication: . XXXIV, 374p. 303 illus. Availability: Copies available: AUM Main Library (1),
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Advanced Materials for Thermal Management of Electronic Packaging by Tong, Xingcun Colin. Publication: . XXII, 618 p. Availability: Copies available: AUM Main Library (1),
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Advanced Flip Chip Packaging by Tong, Ho-Ming. Publication: . VII, 560 p. 413 illus., 242 illus. in color. Availability: Copies available: AUM Main Library (1),
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Reliability of Microtechnology by Liu, Johan. Publication: . XIII, 204p. 50 illus. Availability: Copies available: AUM Main Library (1),
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Moisture Sensitivity of Plastic Packages of IC Devices by Fan, X.J. Publication: . XIV, 558p. Availability: Copies available: AUM Main Library (1),
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Cellular Nanoscale Sensory Wave Computing by Baatar, Chagaan. Publication: . VIII, 249p. Availability: Copies available: AUM Main Library (1),
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RF and Microwave Microelectronics Packaging by Kuang, Ken. Publication: . XVI, 285 p. Availability: Copies available: AUM Main Library (1),
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Three Dimensional Integrated Circuit Design by Xie, Yuan. Publication: Availability: Copies available: AUM Main Library (1),
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Strain Effect in Semiconductors by Sun, Yongke. Publication: Availability: Copies available: AUM Main Library (1),
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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections by Tan, Cher Ming. Publication: . VIII, 152 p. Availability: Copies available: AUM Main Library (1),
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The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects by Grossmann, Günter. Publication: . VIII, 313 p. 202 illus., 22 illus. in color. Availability: Copies available: AUM Main Library (1),
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